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A memory test system works with MCP/flash devices and memory-embedded microcontrollers used in refrigerators and washing-machines, cell phones, cars, and consumer products. The system tests up to 256 devices simultaneously. It offers both DRAM test and flash memory functions such as error checking, correction, and block management.

For more on this subject, subscribe to GlobalSpec's e-Newsletter DirectU2 The world of Electronic Product Design.

Is finding and debugging random and infrequent problems important for embedded device design? Introduced in 1996, all major scope vendors now offer mixed signal oscilloscopes. This white paper reviews some of the factors that affect oscilloscope update rates, and tells how to compute probabilities of capturing infrequent events.

For PCB or package designs, crosstalk, reflections, ringing, and other signal integrity challenges are on the rise. System-level hybrid analysis can help with these design-side issues. Learn the relationship between signal and power integrity, and EMC issues. The article discusses coupling among traces, planes, vias, and other design structures.

To observe BGA balls, electrodes, or other PCB structures, the depth-of-field of a 3D digital microscope is deep, allowing it to accurately focus on various shapes, including spherical objects. More conventional microscopes have limited depth-of-field, and details can be missed. The digital microscope also can enlarge objects in 3D.

2D inspection is commonly used as a production tool. However, with the current economic emphasis on reducing costs, it also can be used with Design of Experiments (DoE) to optimize the production process and increase yields. In SMT assembly, it can help set cleaning frequency, print speeds, and pressures. (See pg. 18.)

Scanning electron microscopy may help detect head-in-pillow (HIP) defects that are increasing since BGA components were converted to Pb-free alloys. The resulting solder joint has electrical integrity, but lacks mechanical strength. The defect is often missed in functional testing. Failure occurs after exposure to physical or thermal stress.

Do you get frustrated with network performance problems? This guide can help isolate the source of the performance degradation. Learn the five steps to successful application troubleshooting: determine the domain of the problem, conduct an application flow analysis, fix the problem, validate, and document the problem. [Access to this article may require a short registration.]

Test procedures evolve over time and may manage hundreds of process signals and transducers. These experts say you can increase throughput and quality using flexible and reliable automation. One automation system displays engineering excellence by achieving a 6x gain in productivity along with improved quality and efficiency.

The 2009 Measurement Science Conference held March 23-27, 2009 at the Disneyland Hotel in Anaheim, CA will consist of sessions that span measurement science technology and management. Topics to be addressed include: pressure, temperature & humidity measurement, Web-assisted management of test equipment, managing metrology for customer and compliance, metrology management issues, a systems engineering approach to calibration, continuous process improvement in quality calibration programs, implementing measurement quality assurance, data and error analysis, and more.

If you find this subject interesting, subscribe to GlobalSpec's e-Newsletter DirectU2 The world of Data Acquisition.

If this image looks all too familiar, consider throwing in a few wire-based handheld devices. And, if you like the uncluttered freedom provided by wireless handhelds and other wireless technology, you'll enjoy this video. Texas Instruments provides a humorous thank-you to all those engineers who helped us all cut the cord. So, if you agree, take some time today to thank an engineer for all those wireless design delights.

How About a Better Bailout?

How about a shot at payback? Does it make sense to invest in a little car company and better battery pack technology? And where else might advanced battery pack technology be used?